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Comparison of LED device substrates

For the production of LED chips, the choice of substrate material is the primary consideration. Which suitable substrate should be used needs to be selected according to the requirements of the device and the LED device. At present, there are generally three kinds of materials on the market that can be used as substrates:

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COB package features description

What is COB? Its full name is chip-on-board, that is, chip-on-board packaging, which is a new packaging method different from SMD surface mount packaging technology. Bonding makes its electrical connection and encapsulates the chip and bond wires with glue.

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Order Cost-Effective Digital Signage to Improve Advertising, Messaging & Communication

3F, Building 2, Science And Technology Innovation Workshop, No. 6 Songjiang Road, Shapu Community, Songgang, Shenzhen, Guangdong, China